Modelling methodology for thermal analysis of hot solder dip process. - Stoyan Stoyanov; Chris Bailey 001; M. O. Alam; Chunyan Yin; Chris Best; Peter Tollafield; Rob Crawford; Mike Parker; Jim Scott (Microelectron. Reliab., 2013)

Statistical analysis of the impact of refinishing process on leaded components. - Chunyan Yin; Chris Best; Chris Bailey 001; Stoyan Stoyanov (Microelectron. Reliab., 2015)