Heat spreading packaging solutions for hybrid bonded 3D-ICs. - Rafael Prieto; Perceval Coudrain; Jean-Philippe Colonna; Y. Hallez; Christian Chancel; Venceslass Rat; Sylvain Dumas; G. Romano; R. Franiatte; C. Brunet-Manquiat; Séverine Cheramy; Alexis Farcy (3DIC, 2016)

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. - Perceval Coudrain; Papa Momar Souare; Rafael Prieto; Vincent Fiori; Alexis Farcy; Laurent Le Pailleur; Jean-Philippe Colonna; Cristiano Santos; Pascal Vivet; M. Haykel Ben Jamaa; Denis Dutoit; François de Crecy; et al. (IEEE Des. Test, 2016)