IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures. - Helmut Köck; Vladimír Kosel; Christian Djelassi; Michael Glavanovics; Dionyz Pogany (Microelectron. Reliab., 2009)

Improved thermal management of low voltage power devices with optimized bond wire positions. - Helmut Köck; Christian Djelassi; Stefano de Filippis; Robert Illing; Michael Nelhiebel; Markus Ladurner; Michael Glavanovics; Dionyz Pogany (Microelectron. Reliab., 2011)