CMOS Imager Technologies for Biomedical Applications. - Joachim N. Burghartz; Thorsten Engelhardt; Heinz-Gerd Graf; Christine Harendt; Harald Richter 001; Cor Scherjon; Karsten Warkentin (ISSCC, 2008)

Ultra-Thin Chips on Foil for Flexible Electronics. - Horst Rempp; Joachim N. Burghartz; Christine Harendt; Nicoleta Pricopi; Marcus Pritschow; Christian Reuter 004; Harald Richter 001; Inge Schindler; Martin Zimmermann 004 (ISSCC, 2008)

Ultra-thin chips and related applications, a new paradigm in silicon technology. - Joachim N. Burghartz; Wolfgang Appel; Christine Harendt; Horst Rempp; Harald Richter 001; Martin Zimmermann 004 (ESSCIRC, 2009)

High Dynamic Range CMOS Imager Technologies for Biomedical Applications. - Heinz-Gerd Graf; Christine Harendt; Thorsten Engelhardt; Cor Scherjon; Karsten Warkentin; Harald Richter 001; Joachim N. Burghartz (IEEE J. Solid State Circuits, 2009)

Manufacturing aspects of an ultra-thin chip technology. - Evangelos A. Angelopoulos; Muhammad S. Al-Shahed; Wolfgang Appel; Stefan Endler 002; Saleh Ferwana; Christine Harendt; Mahadi-Ul Hassan; Horst Rempp; Martin Zimmermann 004; Joachim N. Burghartz (ESSDERC, 2012)

Thermal characterization and modeling of ultra-thin silicon chips. - Muhammad Alshahed; Zili Yu; Horst Rempp; Harald Richter 001; Christine Harendt; Joachim N. Burghartz (ESSDERC, 2014)

Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips. - Christine Harendt; Zili Yu; Joachim N. Burghartz; Jan Kostelnik; Andreas Kugler; Stefan Saller (ESSDERC, 2014)

600 V, low-leakage AlGaN/GaN MIS-HEMT on bulk GaN substrates. - Muhammad Alshahed; Mohammed Alomari; Christine Harendt; Joachim N. Burghartz; C. Wachter; T. Bergunde; S. Lutgen (ESSDERC, 2016)

Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors. - Daniel Hera; Armin Berndt; Thomas Günther; Stephan Schmiel; Christine Harendt; André Zimmermann (Sensors, 2017)