An introduction to Cu electromigration. - Christine S. Hau-Riege (Microelectron. Reliab., 2004)

The electromigration behavior of copper pillars for different current directions and pillar shapes. - Christine S. Hau-Riege; You-Wen Yau; Kevin Caffey; Rajneesh Kumar; YangYang Sun; Andy Bao; Milind Shah; Lily Zhao; Omar Bchir; Ahmer Syed; Steve Bezuk (IRPS, 2015)

Electromigration of multi-solder ball test structures. - Christine S. Hau-Riege; Huilin Xu; You-Wen Yau; Manasi S. Kakade; Jianfeng Li; Xiaonan Zhang; Hosain Farr (IRPS, 2018)