Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. - Emilie Bourjot; Paul Stewart; Christophe Dubarry; E. Lagoutte; E. Rolland; Nicolas Bresson; G. Romano; D. Scevola; Viorel Balan; Jérôme Dechamp; Marc Zussy; Gaëlle Mauguen; et al. (3DIC, 2019)

3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. - Christophe Dubarry; Lucile Arnaud; Maria-Luisa Calvo-Muñoz; Gaëlle Mauguen; Stéphane Moreau; R. Crochemore; Nicolas Bresson; Bernard Aventurier (3DIC, 2021)

Die-to-Wafer Hybrid Bonding Impact at MM-Wave Frequencies. - Mohammad Alsukour; Olivier Valorge; Margot Faure; Loïc Vincent; Victor Milon; Pascal Chevalier 002; Emmanuel Pistono; Jean-Daniel Arnould; Christophe Dubarry (3DIC, 2024)

Hybrid Integration of 3D-RF Interconnects on AlGaN/GaN/Si HEMT RF Transistor featuring 2.2W/mm Psat & 41% PAE @28GHz using a Robust and Cost-Effective Chiplet Heterogeneous Bonding Technique. - A. Divay; Olivier Valorge; Christophe Dubarry; M. Medbouhi; Rémi Franiatte; Daniel Mermin; R. Velard; Y. Gobil; F. Morisot; Erwan Morvan; Ismael Charlet; Luca Lucci; et al. (VLSI Technology and Circuits, 2024)