Fabrication of TSV-based silicon interposers. - Dean Malta; Erik Vick; Scott H. Goodwin; Christopher Gregory; Matthew Lueck; Alan Huffman; Dorota Temple (3DIC, 2010)

Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration. - Jason D. Reed; Scott H. Goodwin; Christopher Gregory; Dorota Temple (3DIC, 2010)

High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 μm pitch. - Matthew Lueck; Chris W. Gregory; Dean Malta; Alan Huffman; John M. Lannon; Dorota Temple (3DIC, 2013)