Demystifying 3D ICs: The Pros and Cons of Going Vertical. - W. Rhett Davis; John M. Wilson 002; Stephen E. Mick; Jian Xu; Hao Hua; Christopher Mineo; Ambarish M. Sule; Michael B. Steer; Paul D. Franzon (IEEE Des. Test Comput., 2005)

Exploring compromises among timing, power and temperature in three-dimensional integrated circuits. - Hao Hua; Christopher Mineo; Kory Schoenfliess; Ambarish M. Sule; Samson Melamed; Ravi Jenkal; W. Rhett Davis (DAC, 2006)

Inter-die signaling in three dimensional integrated circuits. - Christopher Mineo; Ravi Jenkal; Samson Melamed; W. Rhett Davis (CICC, 2008)

The benefits of 3D networks-on-chip as shown with LDPC decoding. - Christopher Mineo; William Rhett Davis (3DIC, 2009)