Reliability Characterization for 12 V Application Using the 22FFL FinFET Technology. - Chen-Yi Su; Mark Armstrong; Sunny Chugh; Mohammed El-tanani; Hannes Greve; Hai Li 008; Mahjabin Maksud; Benjamin Orr; Christopher Perini; James Palmer 002; Leif Paulson; Stephen Ramey; et al. (IRPS, 2020)

Intrinsic Reliability of BEOL interlayer dielectric. - James Palmer 002; Galor Zhang; Justin R. Weber; Cheyun Lin; Christopher Perini; Rahim Kasim (IRPS, 2021)

Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced process nodes. - Rahim Kasim; Cheyun Lin; Christopher Perini; James Palmer 002; N. Gilda; S. Imam; Justin R. Weber; C. Wallace; Jeffery Hicks (IRPS, 2023)

Integration of Si-Interposer and High Density MIM Capacitor on 2.5D Foveros Face-to-Face Architecture. - Christopher Pelto; R. Aggarwal; R. Ahan; M. Armstrong; M. Bebek; M. Blount; S. Chowdhury; J. Chuah; C. Connor; T. DeBonis; B. Dhayal; A. Dougless; et al. (VLSI Technology and Circuits, 2024)