TSV/FET proximity study using dense addressable transistor arrays. - Raphael Robertazzi; Kanak Agarwal 001; Bucknell Webb; Christy Tyberg (IRPS, 2015)

Thermal analysis of multi-layer functional 3D logic stacks. - Michael Scheuermann; Shurong Tian; Raphael Robertazzi; Matthew R. Wordeman; C. Bergeron; H. Jacobson; Phillip J. Restle; Joel Silberman; Christy Tyberg (3DIC, 2016)

Analytical test of 3D integrated circuits. - Raphael Robertazzi; Micheal Scheurman; Matt Wordeman; Shurong Tian; Christy Tyberg (ITC, 2017)