Wafer-level 3D integration using hybrid bonding. - Cheng-Ta Ko; Kuan-Neng Chen; Wei-Chung Lo; Chuan-An Cheng; Wen-Chun Huang; Zhi-Cheng Hsiao; Huan-Chun Fu; Yu-Hua Chen (3DIC, 2010)

Cu-based bonding technology for 3D integration applications. - Kuan-Neng Chen; Z. Xu; Fei Liu; Cheng-Ta Ko; Chuan-An Cheng; W. C. Huang; H. L. Lin; C. Cabral; Zhi-Cheng Hsiao; N. Klymko; Hsin-Chia Fu; Y. H. Chen; et al. (3DIC, 2011)

18.6 2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications. - Po-Tsang Huang; Lei-Chun Chou; Teng-Chieh Huang; Shang-Lin Wu; Tang-Shuan Wang; Yu-Rou Lin; Chuan-An Cheng; Wen-Wei Shen; Kuan-Neng Chen; Jin-Chern Chiou; Ching-Te Chuang; Wei Hwang; et al. (ISSCC, 2014)

2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications. - Po-Tsang Huang; Shang-Lin Wu; Yu-Chieh Huang; Lei-Chun Chou; Teng-Chieh Huang; Tang-Hsuan Wang; Yu-Rou Lin; Chuan-An Cheng; Wen-Wei Shen; Ching-Te Chuang; Kuan-Neng Chen; Jin-Chern Chiou; et al. (IEEE Trans. Biomed. Circuits Syst., 2014)

Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. - Chuan-An Cheng; Ryuichi Sugie; Tomoyuki Uchida; Kou-Hua Chen; Chi-Tsung Chiu; Kuan-Neng Chen (3DIC, 2015)