Technology, performance, and computer-aided design of three-dimensional integrated circuits. - Shamik Das; Andy Fan; Kuan-Neng Chen; Chuan Seng Tan; Nisha Checka; Rafael Reif (ISPD, 2004)

Multi-layer 3D silicon electronics enabled by wafer bonding. - Chuan Seng Tan (2006)

Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. - Dau Fatt Lim; Shiv Govind Singh; Xiao Fang Ang; Jun Wei; Chee Mang Ng; Chuan Seng Tan (3DIC, 2009)

Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack. - Shiv Govind Singh; Chuan Seng Tan (3DIC, 2009)

Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement. - Lan Peng; Hongyu Li; Dau Fatt Lim; Riko I. Made; Guo-Qiang Lo; Dim-Lee Kwong; Chuan Seng Tan (3DIC, 2010)

Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone. - Dau Fatt Lim; K. C. Leong; Chuan Seng Tan (3DIC, 2011)

3D integration of MEMS and CMOS via Cu-Cu bonding with simultaneous formation of electrical, mechanical and hermetic bonds. - Revanth Nadipalli; Ji Fan; Holden King Ho Li; Keng Hoong Wee; Hao Yu 001; Chuan Seng Tan (3DIC, 2011)

Integration schemes and enabling technologies for three-dimensional integrated circuits. - Kuan-Neng Chen; Chuan Seng Tan (IET Comput. Digit. Tech., 2011)

Three-Dimensional Integration of Integrated Circuits - an Introduction. - Chuan Seng Tan (3D Integration for NoC-based SoC Architectures, 2011)

Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. - Chuan Seng Tan; Dau Fatt Lim; Xiao Fang Ang; Jun Wei; K. C. Leong (Microelectron. Reliab., 2012)

Integration of CNT in TSV (≤5 μm) for 3D IC application and its process challenges. - Kaushik Ghosh; C. C. Yap; Beng Kang Tay; Chuan Seng Tan (3DIC, 2013)

The dependency of TSV keep-out zone (KOZ) on Si crystal direction and liner material. - Jiye Zhang; Lin Zhang; Yuanwei Dong; Hongyu Li; Cher Ming Tan; Guangrui Xia; Chuan Seng Tan (3DIC, 2013)

Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model. - Yang Shang; Chun Zhang; Hao Yu 001; Chuan Seng Tan; Xin Zhao 001; Sung Kyu Lim (ASP-DAC, 2013)

Reliable 3-D Clock-Tree Synthesis Considering Nonlinear Capacitive TSV Model With Electrical-Thermal-Mechanical Coupling. - Sai Manoj Pudukotai Dinakarrao; Hao Yu 001; Yang Shang; Chuan Seng Tan; Sung Kyu Lim (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013)

Simulation and design of AIN piezoelectric resonator for infrared sensing application utilizing lamb wave mode. - Wan Chia Ang; Piotr Kropelmcki; Andrew Benson Randies; Alex Yuandong Gu; Kam Chew Leong; Chuan Seng Tan (ISSNIP, 2014)

Robust Electromigration reliability through engineering optimization. - Wee Loon Ng; Kheng Chok Tee; Junfeng Liu; Yong Chiang Ee; Oliver Aubel; Chuan Seng Tan; Kin Leong Pey (Microelectron. Reliab., 2014)

Copper micro and nano particles mixture for 3D interconnections application. - Yuan Yuan Dai; Mei Zhen Ng; P. Anantha; Chee Lip Gan; Chuan Seng Tan (3DIC, 2015)

Through-substrate via (TSV) with embedded capacitor as an on-chip energy storage element. - Ye Lin; Chuan Seng Tan (3DIC, 2016)

Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation. - Marvin Chan; Cher Ming Tan; Kheng Chooi Lee; Chuan Seng Tan (Microelectron. Reliab., 2016)

Yield Enhancement of Face-to-Face Cu-Cu Bonding With Dual-Mode Transceivers in 3DICs. - Myat Thu Linn Aung; Takefumi Yoshikawa; Chuan Seng Tan; Tony Tae-Hyoung Kim (IEEE Trans. Very Large Scale Integr. Syst., 2017)

Two-Step Fabrication of Mid-Infrared Linear Variable Optical Filter Using SU-8 as Mask. - Simon Chun Kiat Goh; Li Lynn Shiau; Nan Chen; Kailiang Chuan; Beng Kang Tay; Chuan Seng Tan (NEMS, 2018)

TiN Guard Ring Around TSV for Cross-Talk Suppression of Parallel Networking of Data Center. - Alit Apriyana Anak Agung; Peng Zhao; Chuan Seng Tan (3DIC, 2019)

Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration. - Jing Tao; Hongyu Li; Peng Zhao; Yu Dian Lim; Anak Agung Alit Apriyana; Chuan Seng Tan (3DIC, 2019)

Mid Infrared Volatile Compounds Detection Using Thermally Reflowed Flip-Stack Die Linear Variable Filter. - Simon Chun Kiat Goh; Kailiang Chuan; Chengkuo Lee; Chuan Seng Tan (IEEE SENSORS, 2019)

Monolithically Integrated GaN+CMOS Logic Circuits Design and Electro-Thermal Analysis for High-Voltage Applications. - Pilsoon Choi; Bugra Kanargi; Kenneth E. Lee; Chirn Chye Boon; Evelyn Wang; Chuan Seng Tan; Dimitri A. Antoniadis; Eugene A. Fitzgerald (BCICTS, 2020)

Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. - Liangxing Hu; Simon Chun Kiat Goh; Yu Dian Lim; Peng Zhao; Michael Joo Zhong Lim; Chuan Seng Tan (3DIC, 2021)

Recognizing Beam Profiles from Silicon Photonics Gratings using Transformer Model. - Yu Dian Lim; Hong Yu Li; Simon Chun Kiat Goh; Xiangyu Wang; Peng Zhao; Chuan Seng Tan (CoRR, 2024)