Fast Protocol Recognition by Network Packet Inspection. - Chuantong Chen; Fengyu Wang; Fengbo Lin; Shanqing Guo; Bin Gong (ICONIP (2), 2011)

Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures. - Masaki Omiya; Kozo Koiwa; Nobuyuki Shishido; Shoji Kamiya; Chuantong Chen; Hisashi Sato; Masahiro Nishida; Takashi Suzuki; Tomoji Nakamura; Toshiaki Suzuki; Takeshi Nokuo (Microelectron. Reliab., 2013)

Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver. - Chanyang Choe; Seungjun Noh; Chuantong Chen; Dongjin Kim 002; Katsuaki Suganuma (Microelectron. Reliab., 2018)

Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure. - Dongjin Kim 002; Chuantong Chen; Aiji Suetake; Chanyang Choe; Tohru Sugahara; Shijo Nagao; Katsuaki Suganuma (Microelectron. Reliab., 2018)

Large-area die-attachment by silver stress migration bonding for power device applications. - Seungjun Noh; Hao Zhang 043; Jeyun Yeom; Chuantong Chen; Caifu Li; Katsuaki Suganuma (Microelectron. Reliab., 2018)

Fourier Enhanced MLP with Adaptive Model Pruning for Efficient Federated Recommendation. - Zhengyang Ai; Guangjun Wu; Binbin Li 001; Yong Wang 032; Chuantong Chen (KSEM (3), 2022)