A modularized 3D heterogeneous system integration platform. - Chun-Ming Huang; Chih-Chyau Yang; Chien-Ming Wu; Chih-Hsing Lin; Chun-Chieh Chiu; Yi-Jun Liu; Chun-Chieh Chu; Nien-Hsiang Chang; Wen-Ching Chen (APCCAS, 2012)

Boundary scan test solution for MorPACK platform. - Chun-Ming Huang; Chih-Chyau Yang; Chien-Ming Wu; Chih-Hsing Lin; Chun-Chieh Chiu; Yi-Jun Liu; Chun-Chieh Chu; Chun-Ping Lin; Wei-De Chien (ISPACS, 2012)

Microphone array application prototyping with MorPACK heterogeneous integrated system. - Yi-Jun Liu; Chih-Chyau Yang; Chih-Hsing Lin; Chun-Chieh Chiu; Chun-Chieh Chu; Chien-Ming Wu; Chun-Ming Huang (SII, 2012)

A novel design flow for a 3D heterogeneous system prototyping platform. - Chun-Ming Huang; Chih-Chyau Yang; Chien-Ming Wu; Chun-Chieh Chiu; Yi-Jun Liu; Chun-Chieh Chu; Nien-Hsiang Chang; Wen-Ching Chen; Chih-Hsing Lin; Hua-Hsin Luo (SoCC, 2012)

52-GBand pre-emphasized PAM-4 encoding of EAM/DFBLD at 1310 nm for inter datacenter link. - Chun-Chieh Chu; Yu-Hong Lin; Huang-Shen Lin; Wei-Li Wu; Chih-Hsien Cheng; Huai-Yung Wang; Cheng-Ting Tsai; Gong-Ru Lin (OECC/PSC, 2019)