Influence of underfill materials on the reliability of coreless flip chip package. - Chun-Chih Chuang; Tsung-Fu Yang; Jin-Ye Juang; Yin-Po Hung; Chau-Jie Zhan; Yu-Min Lin; Ching-Tsung Lin; Pei-Chen Chang; Tao-Chih Chang (Microelectron. Reliab., 2008)

Simultaneous transistor pairing and placement for CMOS standard cells. - Ang Lu; Hsueh-Ju Lu; En-Jang Jang; Yu-Po Lin; Chun-Hsiang Hung; Chun-Chih Chuang; Rung-Bin Lin (DATE, 2015)