Test Integration for SOC Supporting Very Low-Cost Testers. - Chun-Chuan Chi; Chih-Yen Lo; Te-Wen Ko; Cheng-Wen Wu (Asian Test Symposium, 2009)

3D DfT architecture for pre-bond and post-bond testing. - Erik Jan Marinissen; Chun-Chuan Chi; Jouke Verbree; Mario Konijnenburg (3DIC, 2010)

A low-cost and scalable test architecture for multi-core chips. - Chun-Chuan Chi; Cheng-Wen Wu; Jin-Fu Li 001 (ETS, 2010)

Multi-visit TAMs to Reduce the Post-Bond Test Length of 2.5D-SICs with a Passive Silicon Interposer Base. - Chun-Chuan Chi; Erik Jan Marinissen; Sandeep Kumar Goel; Cheng-Wen Wu (Asian Test Symposium, 2011)

A low-cost wireless interface with no external antenna and crystal oscillator for cm-range contactless testing. - Chin-Fu Li; Chi-Ying Lee; Chen-Hsing Wang; Shu-Lin Chang; Li-Ming Denq; Chun-Chuan Chi; Hsuan-Jung Hsu; Ming-Yi Chu; Jing-Jia Liou; Shi-Yu Huang; Po-Chiun Huang; Hsi-Pin Ma; et al. (DAC, 2011)

DfT Architecture for 3D-SICs with Multiple Towers. - Chun-Chuan Chi; Erik Jan Marinissen; Sandeep Kumar Goel; Cheng-Wen Wu (ETS, 2011)

Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base. - Chun-Chuan Chi; Erik Jan Marinissen; Sandeep Kumar Goel; Cheng-Wen Wu (ITC, 2011)

3D-IC BISR for stacked memories using cross-die spares. - Chun-Chuan Chi; Yung-Fa Chou; Ding-Ming Kwai; Yu-Ying Hsiao; Cheng-Wen Wu; Yu-Tsao Hsing; Li-Ming Denq; Tsung-Hsiang Lin (VLSI-DAT, 2012)

A DfT Architecture for 3D-SICs Based on a Standardizable Die Wrapper. - Erik Jan Marinissen; Chun-Chuan Chi; Mario Konijnenburg; Jouke Verbree (J. Electron. Test., 2012)

3D-IC interconnect test, diagnosis, and repair. - Chun-Chuan Chi; Cheng-Wen Wu; Min-Jer Wang; Hung-Chih Lin (VTS, 2013)

On Improving Interconnect Defect Diagnosis Resolution and Yield for Interposer-Based 3-D ICs. - Chun-Chuan Chi; Bing-Yang Lin; Cheng-Wen Wu; Min-Jer Wang; Hung-Chih Lin; Ching-Nen Peng (IEEE Des. Test, 2014)

Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base. - Chun-Chuan Chi; Erik Jan Marinissen; Sandeep Kumar Goel; Cheng-Wen Wu (IEEE Trans. Very Large Scale Integr. Syst., 2014)