Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations. - Hyung-Chu Choi; Yifan Guo; William LaFontaine; Chun K. Lim (IBM J. Res. Dev., 1993)

Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation. - Yifan Guo; Chun K. Lim; William T. Chen; Charles G. Woychik (IBM J. Res. Dev., 1993)

Preface. - Chun K. Lim; Thomas Caulfield; Joseph Benenati (IBM J. Res. Dev., 1993)