Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method. - Chun-Sean Lau; Mohd Zulkifly Abdullah; F. Che Ani (Microelectron. Reliab., 2012)

Recent fluid-structure interaction modeling challenges in IC encapsulation - A review. - C. Y. Khor; Mohd Zulkifly Abdullah; Chun-Sean Lau; I. A. Azid (Microelectron. Reliab., 2014)

Influence of solder bump arrangements on molded IC encapsulation. - C. Y. Khor; Mohd Zulkifly Abdullah; Chun-Sean Lau; W. C. Leong; M. S. Abdul Aziz (Microelectron. Reliab., 2014)