Fault Diagnosis of Wafer Acceptance Test and Chip Probing Between Front-End-of-Line and Back-End-of-Line Processes. - Shu-Kai S. Fan; Chun-Wei Cheng; Du-Ming Tsai (IEEE Trans Autom. Sci. Eng., 2022)

Performance Improvement for Coil Spacing Misalignment of a Wireless Power Transfer Converter. - Chun-Wei Cheng; Hong-Wen Song; Han-Cheng Wu; Zhi-Xuan Chou; Jen-Hao Teng (IAS, 2025)