A 28-Gb/mm2 4XX-Layer 1-Tb 3-b/Cell WF-Bonding 3D-nand Flash With 5.6-Gb/s/Pin IOs. - Sang-Soo Park; Jaedoeg Lyu; Myungjun Kim; Jaeyun Lee; Youngsun Song; Chung-Ho Yu; Makoto Hirano; Yongseok Kwon; Jonghoon Park; Ho-Joon Kim; Daein Lee; Donghyun Seo; et al. (IEEE J. Solid State Circuits, 2026)