Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound. - Yanhong Tian; Chunjin Hang; Chunqing Wang; G. Q. Ouyang; D. S. Yang; J. P. Zhao (Microelectron. Reliab., 2011)

Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints. - Ying Ding; Ruyu Tian; Xiuli Wang; Chunjin Hang; Fang Yu; Ling Zhou; Xiangang Meng; Yanhong Tian (Microelectron. Reliab., 2015)

Mechanical Properties and Fatigue Life Analysis of Motion Cables in Sensors under Cyclic Loading. - Weizhe Liang; Wei Guan; Ying Ding; Chunjin Hang; Yan Zhou; Xiaojing Zou; Shenghai Yue (Sensors, 2024)