Off-chip Decoupling Capacitor Allocation for Chip Package Co-Design. - Hao Yu 001; Chunta Chu; Lei He 001 (DAC, 2007)

Temperature aware microprocessor floorplanning considering application dependent power load. - Chunta Chu; Xinyi Zhang; Lei He 001; Tong Jing (ICCAD, 2007)

Fast Analysis of a Large-Scale Inductive Interconnect by Block-Structure-Preserved Macromodeling. - Hao Yu 001; Chunta Chu; Yiyu Shi 001; David Smart; Lei He 001; Sheldon X.-D. Tan (IEEE Trans. Very Large Scale Integr. Syst., 2010)