RF Packaging for Space Applications: from Micropackage to SOP - "System On a Package". - Claude Drevon (Microelectron. Reliab., 2001)

Non destructive control of flip chip packages for space applications. - Mathieu Paillard; C. Schaffauser; Claude Drevon; Jean Louis Cazaux; Hans Reinhard Schubach; F. Frese (Microelectron. Reliab., 2004)

Gamma radiation effects on RF MEMS capacitive switches. - Aurelian Crunteanu; Arnaud Pothier; Pierre Blondy; Frederic Dumas-Bouchiat; C. Champeaux; A. Catherinot; P. Tristant; Olivier Vendier; Claude Drevon; Jean Louis Cazaux (Microelectron. Reliab., 2006)

Quasi hermetic packaging for new generation of spaceborn microwave equipment. - Philippe Monfraix; Regis Barbaste; Jean Luc Muraro; Claude Drevon; Jean Louis Cazaux (Microelectron. Reliab., 2009)