Migrating from planar to FinFET for further CMOS scaling: SOI or bulk? - Thomas Chiarella; Liesbeth Witters; Abdelkarim Mercha; Christoph Kerner; Rok Dittrich; Michal Rakowski; Claude Ortolland; Lars-Åke Ragnarsson; Bertrand Parvais; An De Keersgieter; Stefan Kubicek; Augusto Redolfi; et al. (ESSCIRC, 2009)

Cap layer and multi-work-function tuning impact on TDDB/BTI in SOI FinFET devices. - Wen Liu; Andreas Kerber; Fernando Guarin; Claude Ortolland (IRPS, 2018)

Process technology for IBM 14-nm processor designs featuring silicon-on-insulator FinFETs. - Scott R. Stiffler; Ravikumar Ramachandran; W. Kirklen Henson; Noah Zamdmer; Kevin McStay; Giuseppe La Rosa; Kevin M. Boyd; Sungjae Lee; Claude Ortolland; Paul C. Parries (IBM J. Res. Dev., 2018)