Effects of mechanical stress and moisture on packaging interfaces. - Stephen L. Buchwalter; Peter J. Brofman; Claudius Feger; Michael A. Gaynes; Kang-Wook Lee 003; Luis J. Matienzo; David L. Questad (IBM J. Res. Dev., 2005)

Mixing, rheology, and stability of highly filled thermal pastes. - Claudius Feger; Jeffrey D. Gelorme; Maurice McGlashan-Powell; Dilhan M. Kalyon (IBM J. Res. Dev., 2005)

Packaging issues for 22nm and beyond. - Claudius Feger (SBCCI, 2011)

Thermal fracture toughness measurement for underfill during temperature change. - Soojae Park; Claudius Feger (Microelectron. Reliab., 2011)