Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. - Emilie Bourjot; Paul Stewart; Christophe Dubarry; E. Lagoutte; E. Rolland; Nicolas Bresson; G. Romano; D. Scevola; Viorel Balan; Jérôme Dechamp; Marc Zussy; Gaëlle Mauguen; et al. (3DIC, 2019)

Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields. - Amadine Jouve; Loïc Sanchez; Clément Castan; Nicolas Bresson; Frank Fournel; Nicolas Raynaud; Pascal Metzger (3DIC, 2019)