Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects. - Clement Huang; Alex Juan; K. C. Su (IRPS, 2020)

Comprehensive Study of Non-Conducting Stress Characteristics in Ultra-Scaled FinFET. - Jun-Yu Huang; Clement Huang; Kun-Chung Huang; Da-You Yang; Hsin-Jou Chuang; Yi-Wen Lee; Eliot Chen; Jen-Hao Lee; Ryan Lu (IRPS, 2025)