Thermal correlation between measurements and FEM simulations in 3D ICs. - Papa Momar Souare; François de Crecy; Vincent Fiori; M. Haykel Ben Jamaa; Alexis Farcy; Sébastien Gallois-Garreignot; Andras Borbely; Jean-Philippe Colonna; Perceval Coudrain; B. Giraud; C. Laviron; Séverine Cheramy; et al. (3DIC, 2013)

Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. - Vincent Fiori; Sébastien Gallois-Garreignot; Hervé Jaouen; Clément Tavernier (Microelectron. Reliab., 2013)

The importance of the spacer region to explain short channels mobility collapse in 28nm Bulk and FDSOI technologies. - Frederic Monsieur; Yvan Denis; Denis Rideau; Vincent Quenette; Gilles Gouget; Clément Tavernier; Hervé Jaouen; Gérard Ghibaudo; Joris Lacord (ESSDERC, 2014)

Laser-Induced Fault Effects in Security-Dedicated Circuits. - Vincent Beroulle; Philippe Candelier; Stephan De Castro; Giorgio Di Natale; Jean-Max Dutertre; Marie-Lise Flottes; David Hély; Guillaume Hubert; Régis Leveugle; Feng Lu; Paolo Maistri; Athanasios Papadimitriou; et al. (VLSI-SoC (Selected Papers), 2014)

Laser-induced fault effects in security-dedicated circuits. - Régis Leveugle; Paolo Maistri; Pierre Vanhauwaert; Feng Lu; Giorgio Di Natale; Marie-Lise Flottes; Bruno Rouzeyre; Athanasios Papadimitriou; David Hély; Vincent Beroulle; Guillaume Hubert; Stephan De Castro; et al. (VLSI-SoC, 2014)

Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies. - Vincent Fiori; Komi-Atchou Ewuame; Sébastien Gallois-Garreignot; Hervé Jaouen; Clément Tavernier (Microelectron. Reliab., 2014)

Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test. - Sébastien Gallois-Garreignot; Naceur Benzima; Etienne Benmussa; Caroline Moutin; Pierre-Olivier Bouchard; Vincent Fiori; Clément Tavernier (Microelectron. Reliab., 2015)

Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs. - Giacomo Garegnani; Vincent Fiori; Gilles Gouget; Frederic Monsieur; Clément Tavernier (Microelectron. Reliab., 2016)