Argos: Building a Web-Centric Application Platform on Top of Android. - Rich Gossweiler; Colin McDonough; James Lin; Roy Want (IEEE Pervasive Comput., 2011)

Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits. - Benjamin Backes; Colin McDonough; Larry Smith 004; Wei Wang 003; Robert E. Geer (J. Electron. Test., 2012)

Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform. - Krishna T. Settaluri; Sen Lin 002; Sajjad Moazeni; Erman Timurdogan; Chen Sun 003; Michele Moresco; Zhan Su 001; Yu-Hsin Chen; Gerald Leake; Douglas LaTulipe; Colin McDonough; Jeremiah Hebding; et al. (ESSCIRC, 2015)

AIM Photonics Design Enablement: A Design-Assembly-Test Platform Advancing the Silicon-Photonics Ecosystem. - Amit Dikshit; Jin Wallner; M. Jobayer Hossain; M. Rakib Uddin; Javery Mann; Anthony Aiello; Lewis G. Carpenter; Yukta Timalsina; Colin McDonough; Nick Fahrenkopf; Gerald Leake; Christopher Baiocco; et al. (OFC, 2024)