Characterization, design, modeling, and model validation of silicon-wafer M: N balun components under matched and unmatched conditions. - Francis M. Rotella; Cristian Cismaru; Yevgeniy Gene Tkachenko; Yuhua Cheng; Peter J. Zampardi (IEEE J. Solid State Circuits, 2006)

An InGaP/GaAs Merged HBT-FET (BiFET) Technology and Applications to the Design of Handset Power Amplifiers. - Andre G. Metzger; Ravi Ramanathan; Jiang Li; Hsiang-Chih Sun; Cristian Cismaru; Hongxiao Shao; Lance Rushing; Kenneth P. Weller; Ce-Jun Wei; Yu Zhu; Alexei Klimashov; Yevgeniy A. Tkachenko; et al. (IEEE J. Solid State Circuits, 2007)

Measuring seam/crack formation in interconnect metallization. - Peter J. Zampardi; Cristian Cismaru; Hal Banbrook; Bin Li (Microelectron. Reliab., 2012)

Formulations and a Computer-Aided Test Method for the Estimation of IMD Levels in an Envelope Feedback RFIC Power Amplifier. - Nicolas G. Constantin; Kai H. Kwok; Hongxiao Shao; Cristian Cismaru; Peter J. Zampardi (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012)

Using Channel Physical Relationships in pHEMT Modeling. - Yingying Yang; Xiao Ping Li; Cristian Cismaru; Ravi Ramanathan (BCICTS, 2020)

A Novel Base Resistance Model Incorporating Base Distributive Effects Along with Emitter Length. - Bin Li; Andre G. Metzger; Cristian Cismaru; Yingying Yang (BCICTS, 2023)