Design issues and considerations for low-cost 3D TSV IC technology. - Geert Van der Plas; Paresh Limaye; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Domae Shinichi; Vladimir Cherman; et al. (ISSCC, 2010)

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. - Geert Van der Plas; Paresh Limaye; Igor Loi; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Vladimir Cherman; et al. (IEEE J. Solid State Circuits, 2011)

Fine grain thermal modeling and experimental validation of 3D-ICs. - Herman Oprins; Adi Srinivasan; Miroslav Cupák; Vladimir Cherman; Cristina Torregiani; Michele Stucchi; Geert Van der Plas; Paul Marchal; Bart Vandevelde; E. Cheng (Microelectron. J., 2011)