Fast wafer level reliability monitoring as a tool to achieve automotive quality for a wafer process. - Andreas Martin 002; Rolf-Peter Vollertsen; A. Mitchell; M. Traving; D. Beckmeier; H. Nielen (Microelectron. Reliab., 2016)

Variation-resilient quantifiable plasma process induced damage monitoring. - D. Beckmeier; Andreas Martin 002 (Microelectron. Reliab., 2018)