Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability. - Mukta G. Farooq; Giuseppe La Rosa; Fen Chen; Prakash Periasamy; Troy L. Graves-abe; Chandrasekharan Kothandaraman; C. Collins; W. Landers; J. Oakley; J. Liu; John Safran; S. Ghosh; et al. (IRPS, 2015)

Oxygen vacancy traps in Hi-K/Metal gate technologies and their potential for embedded memory applications. - Chandrasekharan Kothandaraman; X. Chen; Dan Moy; Dallas Lea; Sami Rosenblatt; Faraz Khan; Derek Leu; Toshiaki Kirihata; D. Ioannou; Giuseppe La Rosa; Jeffrey B. Johnson; Norman Robson; et al. (IRPS, 2015)

Self-heating characterization and its applications in technology development. - Peter C. Paliwoda; Maria Toledano-Luque; Tanya Nigam; Fernando Guarin; M. Nour; S. Cimino; L. Pantisano; A. Gupta; Oscar Huerta-Gonzalez; M. Hauser; W. Liu; A. Vayshenker; et al. (NATW, 2020)