Influence of transient flow and solder bump resistance on underfill process. - J. W. Wan; Wen-Jun Zhang 005; D. J. Bergstrom (Microelectron. J., 2005)

Recent advances in modeling the underfill process in flip-chip packaging. - J. W. Wan; Wen-Jun Zhang 005; D. J. Bergstrom (Microelectron. J., 2007)

Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging. - J. W. Wan; Wen-Jun Zhang 005; D. J. Bergstrom (Microelectron. Reliab., 2008)

Modeling of Cell Cultures in Perfusion Bioreactors. - Xin Yan; D. J. Bergstrom; X. B. Chen (IEEE Trans. Biomed. Eng., 2012)