MEMS technology integrated in the CMOS back end. - Roberto Gaddi; Robertus Petrus Van Kampen; Anartz Unamuno; Vikram Joshi; D. Lacey; Mickael Renault; Charles Smith; Richard Knipe; Dennis Yost (Microelectron. Reliab., 2010)

Study on thermal performance of high power LED employing aluminum filled epoxy composite as thermal interface material. - P. Anithambigai; S. Shanmugan; D. Mutharasu; T. Zahner; D. Lacey (Microelectron. J., 2014)