Thermo-mechanical finite element analysis in a multichip build up substrate based package design. - Xiaowu Zhang; Ee-Hua Wong; Charles Lee; Tai Chong Chai; Yiyi Ma; Poi-Siong Teo; D. Pinjala; Srinivasamurthy Sampath (Microelectron. Reliab., 2004)

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). - Xiaowu Zhang; Kripesh Vaidyanathan; Tai Chong Chai; Teck Chun Tan; D. Pinjala (Microelectron. Reliab., 2008)