Interfacial fracture toughness of Pb-free solders. - S. M. Hayes; Nikhilesh Chawla; D. R. Frear (Microelectron. Reliab., 2009)

High-lead flip chip bump cracking on the thin organic substrate in a module package. - J. W. Jang; L. Li; P. Bowles; R. Bonda; D. R. Frear (Microelectron. Reliab., 2012)