Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size. - Markus Thoben; X. Xie; D. Silber; Jürgen Wilde (Microelectron. Reliab., 2001)

Different types of avalanche-induced moving current filaments under the influence of doping inhomogeneities. - S. Milady; D. Silber; Franz-Josef Niedernostheide; Hans Peter Felsl (Microelectron. J., 2008)