Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature. - Y. C. Chan; D. Y. Luk (Microelectron. Reliab., 2002)

Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure. - Y. C. Chan; D. Y. Luk (Microelectron. Reliab., 2002)