Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application. - Jong-Woong Kim; Dae-Gon Kim; Seung-Boo Jung (Microelectron. Reliab., 2006)

Effect of high-speed loading conditions on the fracture mode of the BGA solder joint. - Jong-Woong Kim; Jin-Kyu Jang; Sang-Ok Ha; Sang-Su Ha; Dae-Gon Kim; Seung-Boo Jung (Microelectron. Reliab., 2008)