Package and solder joint reliability analysed by FEM simulation and experiments. - Bart Vandevelde; Dag Andersson (Microelectron. Reliab., 2004)

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. - Artur Wymyslowski; Bart Vandevelde; Dag Andersson (Microelectron. Reliab., 2007)

The shear strength of nano-Ag sintered joints and the use of Ag interconnects in the design and manufacture of SiGe-based thermo-electric modules. - Michael Edwards; Klas Brinkfeldt; Ulrich Rusche; Tobias Bukes; Gerd Gaiser; Melina Da Silva; Dag Andersson (Microelectron. Reliab., 2015)