Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates. - Jinglin Bi; Anmin Hu; Jing Hu; Tingbi Luo; Ming Li; Dali Mao (Microelectron. Reliab., 2011)

Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder. - Tingbi Luo; Anmin Hu; Jing Hu; Ming Li; Dali Mao (Microelectron. Reliab., 2012)

Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers. - Mingzhi Ni; Ming Li; Dali Mao (Microelectron. Reliab., 2012)

Study of free air ball formation in Ag-8Au-3Pd alloy wire bonding. - Rui Guo 003; Liming Gao; Dali Mao; Ming Li; Xu Wang; Zhong Lv; Hope Chiu (Microelectron. Reliab., 2014)