Opportunities brought by sequential 3D CoolCube™ integration. - Maud Vinet; Perrine Batude; Claire Fenouillet-Béranger; Laurent Brunet; Vincent Mazzocchi; Cao-Minh Vincent Lu; Fabien Deprat; Jessy Micout; Bernard Previtali; Paul Besombes; Nils Rambal; François Andrieu; et al. (ESSDERC, 2016)

Dynamic vs Static Burn-in for 16nm Production. - Jeffrey Zhang 008; Antai Xu; Daniel Gitlin; Desmond Yeo (IRPS, 2020)

A Method of Developing Qualification Plans for Board Products. - Jeffrey Zhang 008; Antai Xu; Daniel Gitlin (IRPS, 2022)