Daniel H. Jung

Affiliations:

Korea Advanced Institute of Science and Technology, Daejeon, South Korea

According to our database¹, Daniel H. Jung authored at least 13 papers between 2013 and 2016.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

Timeline

Legend:

Book

In proceedings

Article

PhD thesis

Dataset

Other

Links

On csauthors.net:

Bibliography

2016

High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs.

[BibT_eX]

[DOI]

IEEE Des. Test, 2016

2015

Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC.

[BibT_eX]

[DOI]

Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015

TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC.

[BibT_eX]

[DOI]

Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.

[BibT_eX]

[DOI]

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Fault detection and isolation of multiple defects in through silicon via (TSV) channel.

[BibT_eX]

[DOI]

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Modeling and analysis of open defect in through silicon via (TSV) channel.

[BibT_eX]

[DOI]

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Eye-diagram simulation and analysis of a high-speed TSV-based channel.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Fault isolation of short defect in through silicon via (TSV) based 3D-IC.

[BibT_eX]

[DOI]

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Daniel H. Jung

Timeline

Legend:

Links

On csauthors.net:

Bibliography

Loading...