A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical InterposerTM. - Suresh Venkatesan; James Lee; Simon Chun Kiat Goh; Brian Pile; Daniel Meerovich; Jinyu Mo; Yang Jing; Lucas Soldano; Baochang Xu; Yu Zhang; Aaron Voon-Yew Thean; Yeow Kheng Lim (VLSI Technology and Circuits, 2022)