Automated multi-device placement, I/O voltage supply assignment, and pin assignment in circuit board design. - Daniel P. Seemuth; Katherine Morrow (FPT, 2013)

Automatic die placement and flexible I/O assignment in 2.5D IC design. - Daniel P. Seemuth; Azadeh Davoodi; Katherine Morrow (ISQED, 2015)

Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers. - Daniel P. Seemuth; Azadeh Davoodi; Katherine Morrow (ASP-DAC, 2017)