Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages. - Jason Y. L. Goh; Mark C. Pitter; Chung W. See; Michael G. Somekh; Daniel Vanderstraeten (Microelectron. Reliab., 2004)

Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation. - Sergey Bychikhin; Georg Haberfehlner; J. Rhayem; Daniel Vanderstraeten; Renaud Gillon; Dionyz Pogany (Microelectron. Reliab., 2010)

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging. - Andrej Ivankovic; Kris Vanstreels; Daniel Vanderstraeten; Guy Brizar; Renaud Gillon; Eddy Blansaer; Bart Vandevelde (Microelectron. Reliab., 2012)

Impact of the leadframe profile on the occurrence of passivation cracks of plastic-encapsulated electronic power devices. - Jan Ackaert; Aditi Malik; Daniel Vanderstraeten (ICICDT, 2013)

Effect of Residual TiN on Reliability of Au Wire Bonds during High Temperature Storage. - John M. McGlone; Guy Brizar; Daniel Vanderstraeten; Dorai Iyer; Sallie Hose; Jeff P. Gambino (IRPS, 2020)