InP-HBT optoelectronic integrated circuits for photonic analog-to-digital conversion. - Tom P. E. Broekaert; Willie Ng; Joseph F. Jensen; Daniel Yap; David L. Persechini; S. Bourgholtzer; Charles H. Fields; Young K. Brown-Boegeman; Binqiang Shi; Robert H. Walden (IEEE J. Solid State Circuits, 2001)

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. - Tong Yan Tee; Chek Lim Kho; Daniel Yap; Carol Toh; Xavier Baraton; Zhaowei Zhong (Microelectron. Reliab., 2003)

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. - Tong Yan Tee; Hun Shen Ng; Daniel Yap; Xavier Baraton; Zhaowei Zhong (Microelectron. Reliab., 2003)

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages. - Tong Yan Tee; Hun Shen Ng; Daniel Yap; Zhaowei Zhong (Microelectron. Reliab., 2003)

Evaluation of Reinforcement-Learning Queue Management Algorithm for Undersea Acoustic Networks Using ns-3. - Peng Zhang; Pedro A. Forero; Daniel Yap; Dusan Radosevic (WNS3, 2022)