Development of reliable low temperature wafer level hermetic bonding using composite seal joint. - Daquan Yu (Microelectron. Reliab., 2012)

The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer. - He Ma; Daquan Yu; Jun Wang (Microelectron. Reliab., 2014)

Design of a compact silicon-based integrated passive band-pass filter with two tunable finite transmission zeros. - Jie Pan; Huijuan Wang; Gengxin Tian; Liqiang Cao; Daquan Yu (Microelectron. J., 2016)

Design and Fabrication of High Density 3D IPDs (Integrated Passive Devices) on Glass Substrate. - Xiaoli Ren; Junying Wei; Daquan Yu (ICTA, 2020)

Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application. - Tianshen Zhou; Shuying Ma; Daquan Yu; Ming Li; Tao Hang (Sensors, 2020)

A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density. - Dongfang Pan; Guolong Li; Fangting Miao; Biao Deng; Junying Wei; Daquan Yu; Ming Liu 022; Lin Cheng 001 (ISSCC, 2021)

Development of a Reliable High-Performance WLP for a SAW Device. - Zuohuan Chen; Daquan Yu (Sensors, 2022)

Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter. - Zuohuan Chen; Daquan Yu; Yi Zhong (Sensors, 2022)

Research on Integration of Photonic and Electronic Chips Based on Glass Interposer (Invited). - Wanyi Yan; Jin Zhao 002; Yongjian Chen; Zhuliang Lin; Dan Zhang; Daquan Yu (TENCON, 2024)

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging. - Chen Yu; Shaocheng Wu; Yi Zhong; Rongbin Xu; Tian Yu; Jin Zhao; Daquan Yu (Sensors, 2024)