Wafer level packaging of a tape flip-chip chip scale packages. - Greg Hotchkiss; Gonzalo Amador; Darvin Edwards; Paul Hundt; Les Stark; Roger Stierman; Gail Heinen (Microelectron. Reliab., 2001)

Keeping hot chips cool: are IC thermal problems hot air? - Ruchir Puri; Devadas Varma; Darvin Edwards; Alan J. Weger; Paul D. Franzon; Andrew Yang; Stephen V. Kosonocky (DAC, 2008)

Dual stage modeling of moisture absorption and desorption in epoxy mold compounds. - Mark D. Placette; Xuejun Fan; Jie-Hua Zhao; Darvin Edwards (Microelectron. Reliab., 2012)